WebThe measurement of RθJA is performed using the following steps (summarized from EIA/JESD51-1, -2, -5, - 6, -7, and -9): Step 1. A device, usually an integrated circuit (IC) package containing a thermal test chip that can both dissipate power and measure the maximum chip temperature, is mounted on a test board. Step 2. Web- JESD51-7: Most surface mount packages. - JESD51-9: Area array (e.g., BGA, WLCSP). - JESD51-10: Through-hole perimeter leaded (e.g., DIP, SIP). - JESD51-11: Through-hole …
EIA/JEDEC STANDARD
WebEIA/JESD51-1 DECEMBER 1995 ELECTRONIC INDUSTRIES ASSOCIATION ENGINEERING DEPARTMENT. NOTICE JEDEC standards and publications contain … WebMCP16311/2 DS20005255C-page 4 2013-2024 Microchip Technology Inc. Feedback Input Bias Current IFB —10250 nA Output Current I OUT 1— — ANotes 1 to 3, Figure 2-7 Switching Characteristics Switching Frequency fSW 425 500 575 kHz Maximum Duty Cycle DCMAX 85 94 — % Note 3 Minimum Duty Cycle DCMIN —2 — %Note 4 High-Side … hero x innovation
Semiconductor and IC Package Thermal Metrics (Rev. C)
WebLatch-up Per Technology 5/0 units/lot EIA/JESD78 Physical Dimensions TI Data Sheet 5/0 EIA/JESD22- B100 Thermal Impedance Theta-JA on board Per Pin-Package EIA/JESD51 Bias Life Test equivalent 125°C / 1000 hours or 116/0 JESD22-A108* Biased Humidity or HAST 85°C / 85% / 1000 hours 130°C / 85% / 96 hours 77/0 JESD22-A101* ... Web5. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A rated printed wiring track widths. See Figure 9 for the current ratings at other durations. Derate current values at -0.61 %/°C for ambient temperatu res above 25°C. Absolute Maximum Ratings, TA = 25 °C (Unless Otherwise Noted) WebLatch-up Per Technology 3(0) 1 EIA/JESD78 Physical Dimensions TI Data Sheet 5(0) 1 EIA/JESD22- B100 Thermal Impedance Theta-JA on board Per Pin-Package N/A EIA/JESD51 Bias Life Test 125°C/1000 hours or equivalent 45(0) 3 JESD22-A108 (1) Biased Humidity 85°C/85%/1000 hours 77(0) JESD22-A101 (1) or hero xoom 110 review